At Pioneer Circuits, we specialize in providing end-to-end solutions for flexible circuit boards (FPCBs), rigid-flex PCBs, and advanced printed circuit board assembly (PCBAs). Our expertise spans across engineering, manufacturing, and assembly, ensuring that your project moves from concept to production with seamless efficiency, precision, and reliability.
With decades of innovation and experience in the aerospace, defense, and high-reliability industries, we deliver cutting-edge PCB solutions that meet the most demanding industry standards, including IPC-6013 Class 3 for peak performance and dependability.
Engineering Excellence
From concurrent engineering to design for manufacturability (DFM), we collaborate closely with your team to create optimized designs that accelerate your time to market.
Advanced Manufacturing
Our state-of-the-art facilities support high-layer count PCBs, large-format designs, and complex material stack-ups, with specialized capabilities such as blind and buried vias, bookbinder, controlled impedance, and EMI shielding.
Precision Assembly & Testing
We provide surface mount technology (SMT), through-hole technology (THT), and advanced PCB testing to ensure quality and performance in every build.
Unlock possibilities with our comprehensive technical expertise.
Our expert processes follow IPC-6013, IPC-6012, IPC- Class 3, and Space Addendum standards, ensuring the highest reliability for mission-critical applications.
- • Flexible laminates per IPC-4204/1/11 and some specialty materials
- • Flexible cover, bond ply, adhesive materials per IPC-4202, IPC-4203/1, and other specialty materials
- • Polyimide Rigid Laminates and Pre-preg per IPC-4101/41 /42
- • Epoxy Rigid laminates and Pre-preg per IPC-4101/24 /26 /126
- • Maximum part size: up to 22” X 36” (PTH “anywhere”); other panel sizes up to 24” X 85” (PTH “either end of cable”)
- • Maximum Layers: >40(+) “Bookbinder” – Staggered Flex Length
The Pioneer Advantage

Industry leader in high-reliability PCBs.

Proven expertise in aerospace, defense, and space exploration applications.

Dedicated support from concept to completion.

Seamless integration of engineering, manufacturing, and assembly.

Innovative material selection and design solutions.